Surajit Kumar Roy, Chandan Giri, Hafizur Rahaman. Optimization of Test Wrapper for TSV Based 3D SOCs. J. Electronic Testing, 32(5):511-529, 2016. [doi]
@article{RoyGR16,
title = {Optimization of Test Wrapper for TSV Based 3D SOCs},
author = {Surajit Kumar Roy and Chandan Giri and Hafizur Rahaman},
year = {2016},
doi = {10.1007/s10836-016-5610-4},
url = {http://dx.doi.org/10.1007/s10836-016-5610-4},
researchr = {https://researchr.org/publication/RoyGR16},
cites = {0},
citedby = {0},
journal = {J. Electronic Testing},
volume = {32},
number = {5},
pages = {511-529},
}