A thermal estimation model for 3D IC using liquid cooled microchannels and thermal TSVs - researchr publication authors

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Surajit Kumar Roy, Supriyo Mandal, Chandan Giri, Hafizur Rahaman. A thermal estimation model for 3D IC using liquid cooled microchannels and thermal TSVs. In 2015 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, South Korea, October 5-7, 2015. pages 122-127, IEEE, 2015. [doi]

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