Testing 3D stacked ICs for post-bond partial/complete stack - researchr publication authors

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Surajit Kumar Roy, Dona Roy, Chandan Giri, Hafizur Rahman. Testing 3D stacked ICs for post-bond partial/complete stack. In 55th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2012, Boise, ID, USA, August 5-8, 2012. pages 522-525, IEEE, 2012. [doi]

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