Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel. High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectronics Reliability, 76:362-367, 2017. [doi]
@article{SabbahBABFGM17,
title = {High temperature ageing of microelectronics assemblies with SAC solder joints},
author = {Wissam Sabbah and Pierre Bondue and Oriol Avino-Salvado and Cyril Buttay and Hélène Frémont and Alexandrine Guédon-Gracia and Hervé Morel},
year = {2017},
doi = {10.1016/j.microrel.2017.06.065},
url = {https://doi.org/10.1016/j.microrel.2017.06.065},
researchr = {https://researchr.org/publication/SabbahBABFGM17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {76},
pages = {362-367},
}