Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel. High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectronics Reliability, 76:362-367, 2017. [doi]
Abstract is missing.