Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura. Mechanical and electrical reliability of copper interconnections for 3DIC. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]
Abstract is missing.