Designing and packaging technology of Renesas SIP

Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa. Designing and packaging technology of Renesas SIP. In International Symposium on Circuits and Systems (ISCAS 2005), 23-26 May 2005, Kobe, Japan. pages 5926-5929, IEEE, 2005. [doi]

@inproceedings{SakamotoSKTA05,
  title = {Designing and packaging technology of Renesas SIP},
  author = {Noriaki Sakamoto and Norihiko Sugita and Takafumi Kikuchi and Hideki Tanaka and Takashi Akazawa},
  year = {2005},
  doi = {10.1109/ISCAS.2005.1465988},
  url = {http://dx.doi.org/10.1109/ISCAS.2005.1465988},
  researchr = {https://researchr.org/publication/SakamotoSKTA05},
  cites = {0},
  citedby = {0},
  pages = {5926-5929},
  booktitle = {International Symposium on Circuits and Systems (ISCAS 2005), 23-26 May 2005, Kobe, Japan},
  publisher = {IEEE},
}