Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings - researchr publication authors

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Miled Ben Salah, Daniel Pasquet, Frederic Voiron, Philippe Descamps, Jean Luc Lefebvre, Dominique Lesenechal. Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings. In IEEE Topical Conference on Wireless Sensors and Sensor Networks, WiSNet 2013, Austin, TX, USA, January 20-23, 2013. pages 100-102, IEEE, 2013. [doi]

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