Miled Ben Salah, Daniel Pasquet, Frederic Voiron, Philippe Descamps, Jean Luc Lefebvre, Dominique Lesenechal. Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings. In IEEE Topical Conference on Wireless Sensors and Sensor Networks, WiSNet 2013, Austin, TX, USA, January 20-23, 2013. pages 100-102, IEEE, 2013. [doi]
@inproceedings{SalahPVDLL13-0,
title = {Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings},
author = {Miled Ben Salah and Daniel Pasquet and Frederic Voiron and Philippe Descamps and Jean Luc Lefebvre and Dominique Lesenechal},
year = {2013},
doi = {10.1109/WiSNet.2013.6488647},
url = {https://doi.org/10.1109/WiSNet.2013.6488647},
researchr = {https://researchr.org/publication/SalahPVDLL13-0},
cites = {0},
citedby = {0},
pages = {100-102},
booktitle = {IEEE Topical Conference on Wireless Sensors and Sensor Networks, WiSNet 2013, Austin, TX, USA, January 20-23, 2013},
publisher = {IEEE},
isbn = {978-1-4673-3104-3},
}