Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury. Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication. In Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky, Ricardo Reis 0001, editors, VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers. Volume 621 of IFIP Advances in Information and Communication Technology, pages 149-178, Springer, 2020. [doi]
@inproceedings{SaligramKBR20a,
title = {Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication},
author = {Rakshith Saligram and Ankit Kaul and Muhannad S. Bakir and Arijit Raychowdhury},
year = {2020},
doi = {10.1007/978-3-030-81641-4_8},
url = {https://doi.org/10.1007/978-3-030-81641-4_8},
researchr = {https://researchr.org/publication/SaligramKBR20a},
cites = {0},
citedby = {0},
pages = {149-178},
booktitle = {VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers},
editor = {Andrea Calimera and Pierre-Emmanuel Gaillardon and Kunal Korgaonkar and Shahar Kvatinsky and Ricardo Reis 0001},
volume = {621},
series = {IFIP Advances in Information and Communication Technology},
publisher = {Springer},
isbn = {978-3-030-81641-4},
}