A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit

Anirban Samanta, Po-Hsuan Chang, Peng Yan, Mingye Fu, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, Yu Zhang, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, Samuel Palermo, S. J. Ben Yoo. A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. In Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, CA, USA, March 5-9, 2023. pages 1-3, IEEE, 2023. [doi]

Abstract

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