William Sanfins, D. Risaletto, F. Richardeau, G. Blondel, M. Chemin, P. Baudesson. Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection. Microelectronics Reliability, 55(9-10):1956-1960, 2015. [doi]
Abstract is missing.