Sachin S. Sapatnekar. Electromigration-Aware Interconnect Design. In Ismail Bustany, William Swartz, editors, Proceedings of the 2019 International Symposium on Physical Design, ISPD 2019, San Francisco, CA, USA, April 14-17, 2019. pages 83-90, ACM, 2019. [doi]
@inproceedings{Sapatnekar19,
title = {Electromigration-Aware Interconnect Design},
author = {Sachin S. Sapatnekar},
year = {2019},
doi = {10.1145/3299902.3313156},
url = {https://doi.org/10.1145/3299902.3313156},
researchr = {https://researchr.org/publication/Sapatnekar19},
cites = {0},
citedby = {0},
pages = {83-90},
booktitle = {Proceedings of the 2019 International Symposium on Physical Design, ISPD 2019, San Francisco, CA, USA, April 14-17, 2019},
editor = {Ismail Bustany and William Swartz},
publisher = {ACM},
isbn = {978-1-4503-6253-5},
}