Design space exploration for robust power delivery in TSV based 3-D systems-on-chip

Suhas M. Satheesh, Emre Salman. Design space exploration for robust power delivery in TSV based 3-D systems-on-chip. In IEEE 25th International SOC Conference, SOCC 2012, Niagara Falls, NY, USA, September 12-14, 2012. pages 307-311, IEEE, 2012. [doi]

Abstract

Abstract is missing.