Ryohei Sato, Akihiro Tsukada, Yukihiro Sato, Yoshiharu Iwata, Hidenori Murata, Shigenobu Sekine, Ryuji Kimura, Keijiroh Kishi. Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{SatoTSIMSKK11,
title = {Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP},
author = {Ryohei Sato and Akihiro Tsukada and Yukihiro Sato and Yoshiharu Iwata and Hidenori Murata and Shigenobu Sekine and Ryuji Kimura and Keijiroh Kishi},
year = {2011},
doi = {10.1109/3DIC.2012.6262946},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262946},
researchr = {https://researchr.org/publication/SatoTSIMSKK11},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}