Yuuta Satomi, Koutaro Hachiya, Toshiki Kanamoto, Ryosuke Watanabe, Atsushi Kurokawa. Thermal placement on PCB of components including 3D ICs. IEICE Electronic Express, 17(3):20190737, 2020. [doi]
@article{SatomiHKWK20,
title = {Thermal placement on PCB of components including 3D ICs},
author = {Yuuta Satomi and Koutaro Hachiya and Toshiki Kanamoto and Ryosuke Watanabe and Atsushi Kurokawa},
year = {2020},
doi = {10.1587/elex.17.20190737},
url = {https://doi.org/10.1587/elex.17.20190737},
researchr = {https://researchr.org/publication/SatomiHKWK20},
cites = {0},
citedby = {0},
journal = {IEICE Electronic Express},
volume = {17},
number = {3},
pages = {20190737},
}