Whisker mitigation measures for Sn-plated Cu for different stress tests

L. Sauter, A. Seekamp, Y. Shibata, Y. Kanameda, H. Yamashita. Whisker mitigation measures for Sn-plated Cu for different stress tests. Microelectronics Reliability, 50(9-11):1631-1635, 2010. [doi]

Abstract

Abstract is missing.