Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits - researchr publication authors

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Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones, Ritwik Chatterjee. Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectronics Journal, 41(1):9-16, 2010. [doi]

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