Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits

Ioannis Savidis, Boris Vaisband, Eby G. Friedman. Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. VLSI Syst., 23(10):2077-2089, 2015. [doi]

Authors

Ioannis Savidis

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Boris Vaisband

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Eby G. Friedman

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