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Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules

O. Schilling, M. Schäfer, K. Mainka, M. Thoben, F. Sauerland. Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules. Microelectronics Reliability, 52(9-10):2347-2352, 2012. [doi]

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O. Schilling

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M. Schäfer

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K. Mainka

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M. Thoben

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F. Sauerland

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