O. Schilling, M. Schäfer, K. Mainka, M. Thoben, F. Sauerland. Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules. Microelectronics Reliability, 52(9-10):2347-2352, 2012. [doi]
@article{SchillingSMTS12,
title = {Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules},
author = {O. Schilling and M. Schäfer and K. Mainka and M. Thoben and F. Sauerland},
year = {2012},
doi = {10.1016/j.microrel.2012.06.095},
url = {http://dx.doi.org/10.1016/j.microrel.2012.06.095},
researchr = {https://researchr.org/publication/SchillingSMTS12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {9-10},
pages = {2347-2352},
}