Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit. Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectronics Reliability, 45(9-11):1544-1549, 2005. [doi]
@article{SchlangenKKB05,
title = {Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations},
author = {Rudolf Schlangen and Uwe Kerst and A. Kabakow and Christian Boit},
year = {2005},
doi = {10.1016/j.microrel.2005.07.033},
url = {http://dx.doi.org/10.1016/j.microrel.2005.07.033},
researchr = {https://researchr.org/publication/SchlangenKKB05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {9-11},
pages = {1544-1549},
}