Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations

Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit. Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectronics Reliability, 45(9-11):1544-1549, 2005. [doi]

Abstract

Abstract is missing.