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Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C

S. Schmitz, M. Schneider-Ramelow, S. Schr̦der. Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200ʡC. Microelectronics Reliability, 51(1):107-112, 2011. [doi]

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