Low Temperature SmartCutTM enables High Density 3D SoC Applications

W. Schwarzenbach, B.-Y. Nguyen, G. Besnard. Low Temperature SmartCutTM enables High Density 3D SoC Applications. In International Conference on IC Design and Technology, ICICDT 2019, Suzhou, China, June 17-19, 2019. pages 1-2, IEEE, 2019. [doi]

Abstract

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