Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers - researchr publication authors

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Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow. Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 372-377, IEEE, 2017. [doi]

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