Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication

Kaushik Sengupta, Suresh Venkatesh, Hooman Saeidi, Xuyang Lu. Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication. In 48th IEEE European Solid State Circuits Conference, ESSCIRC 2022, Milan, Italy, September 19-22, 2022. pages 546-549, IEEE, 2022. [doi]

Authors

Kaushik Sengupta

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Suresh Venkatesh

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Hooman Saeidi

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Xuyang Lu

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