Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application - researchr publication authors

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Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim. Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]

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