Tae Joon Seok, Victor Kopp, Dan Neugroschl, Johannes Henriksson, Jianheng Luo, Ming C. Wu. High density optical packaging of high radix silicon photonic switches. In Optical Fiber Communications Conference and Exhibition, OFC 2017, Los Angeles, CA, USA, March 19-23, 2017. pages 1-3, IEEE, 2017. [doi]
Abstract is missing.