Caleb Serafy, Ankur Srivastava. TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(4):554-562, 2015. [doi]
@article{SerafyS15,
title = {TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement},
author = {Caleb Serafy and Ankur Srivastava},
year = {2015},
doi = {10.1109/TCAD.2014.2385754},
url = {http://dx.doi.org/10.1109/TCAD.2014.2385754},
researchr = {https://researchr.org/publication/SerafyS15},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {34},
number = {4},
pages = {554-562},
}