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Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process

P. J. Shang, L. Zhang, Z. Q. Liu, J. Tan, J. K. Shang. Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process. Microelectronics Reliability, 53(6):899-905, 2013. [doi]

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P. J. Shang

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L. Zhang

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Z. Q. Liu

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J. Tan

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J. K. Shang

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