P. J. Shang, L. Zhang, Z. Q. Liu, J. Tan, J. K. Shang. Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process. Microelectronics Reliability, 53(6):899-905, 2013. [doi]
Abstract is missing.