Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application

Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu. Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. Microelectronics Reliability, 91:38-45, 2018. [doi]

Abstract

Abstract is missing.