Debendra Das Sharma, Swadesh Choudhary, Peter Z. Onufryk, Rob Pelt. On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach. In IEEE Symposium on High-Performance Interconnects, HOTI 2025, San Jose, CA, USA, August 20-22, 2025. pages 87-96, IEEE, 2025. [doi]
Abstract is missing.