Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima. Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. In IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{ShenLHSKTMKF23,
title = {Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last},
author = {Jiayi Shen and Chang Liu and Tadaaki Hoshi and Atsushi Sinoda and Hisashi Kino and Tetsu Tanaka and Mariappan Murugesan and Mitsumasa Koyanagi and Takafumi Fukushima},
year = {2023},
doi = {10.1109/3DIC57175.2023.10154930},
url = {https://doi.org/10.1109/3DIC57175.2023.10154930},
researchr = {https://researchr.org/publication/ShenLHSKTMKF23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023},
publisher = {IEEE},
isbn = {979-8-3503-1137-2},
}