Siyuan Shen, Xiangfen Wang, Bo Wan, Guicui Fu. An Electrical Behavior Analysis Method of Esd Protection Structure in Chip Based on Spice. In IEEE Region 10 Conference, TENCON 2025, Kota Kinabalu, Malaysia, October 27-30, 2025. pages 659-663, IEEE, 2025. [doi]
Abstract is missing.