Xinjun Sheng, Lei Jia, Zhenhua Xiong, Zhiping Wang, Han Ding. ACF-COG interconnection conductivity inspection system using conductive area. Microelectronics Reliability, 53(4):622-628, 2013. [doi]
@article{ShengJXWD13,
title = {ACF-COG interconnection conductivity inspection system using conductive area},
author = {Xinjun Sheng and Lei Jia and Zhenhua Xiong and Zhiping Wang and Han Ding},
year = {2013},
doi = {10.1016/j.microrel.2012.11.004},
url = {http://dx.doi.org/10.1016/j.microrel.2012.11.004},
researchr = {https://researchr.org/publication/ShengJXWD13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {4},
pages = {622-628},
}