L. Y. Sheng, C. De Tandt, Willy Ranson, Roger Vounckx. Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips. Microelectronics Reliability, 41(2):307-315, 2001. [doi]
@article{ShengTRV01,
title = {Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips},
author = {L. Y. Sheng and C. De Tandt and Willy Ranson and Roger Vounckx},
year = {2001},
doi = {10.1016/S0026-2714(00)00226-2},
url = {http://dx.doi.org/10.1016/S0026-2714(00)00226-2},
tags = {C++, reliability},
researchr = {https://researchr.org/publication/ShengTRV01},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {41},
number = {2},
pages = {307-315},
}