Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips

L. Y. Sheng, C. De Tandt, Willy Ranson, Roger Vounckx. Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips. Microelectronics Reliability, 41(2):307-315, 2001. [doi]

Abstract

Abstract is missing.