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Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system

X. Q. Shi, H. L. J. Pang, X. R. Zhang. Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectronics Reliability, 44(5):841-852, 2004. [doi]

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