Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles

Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li. Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. Microelectronics Reliability, 50(12):2020-2025, 2010. [doi]

Abstract

Abstract is missing.