Transient and fine-grained voltage adaptation for variation resilience in VLSI interconnects

Kyu-Nam Shim, Jiang Hu. Transient and fine-grained voltage adaptation for variation resilience in VLSI interconnects. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 80-86, IEEE, 2011. [doi]

@inproceedings{ShimH11,
  title = {Transient and fine-grained voltage adaptation for variation resilience in VLSI interconnects},
  author = {Kyu-Nam Shim and Jiang Hu},
  year = {2011},
  doi = {10.1109/ISQED.2011.5770707},
  url = {http://dx.doi.org/10.1109/ISQED.2011.5770707},
  researchr = {https://researchr.org/publication/ShimH11},
  cites = {0},
  citedby = {0},
  pages = {80-86},
  booktitle = {Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011},
  publisher = {IEEE},
  isbn = {978-1-61284-914-0},
}