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Lumped Element High Precision X-Band Bandpass Filter with Through Silicon Via (TSV) Integrated Passive Device (IPD) Technology

Ki R. Shin, Kim Eilert. Lumped Element High Precision X-Band Bandpass Filter with Through Silicon Via (TSV) Integrated Passive Device (IPD) Technology. In IEEE Radio and Wireless Symposium, RWS 2021, San Diego, CA, USA, January 17-22, 2021. pages 147-150, IEEE, 2021. [doi]

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Ki R. Shin

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Kim Eilert

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