Ki R. Shin, Kim Eilert. Lumped Element High Precision X-Band Bandpass Filter with Through Silicon Via (TSV) Integrated Passive Device (IPD) Technology. In IEEE Radio and Wireless Symposium, RWS 2021, San Diego, CA, USA, January 17-22, 2021. pages 147-150, IEEE, 2021. [doi]
@inproceedings{ShinE21,
title = {Lumped Element High Precision X-Band Bandpass Filter with Through Silicon Via (TSV) Integrated Passive Device (IPD) Technology},
author = {Ki R. Shin and Kim Eilert},
year = {2021},
doi = {10.1109/RWS50353.2021.9360374},
url = {https://doi.org/10.1109/RWS50353.2021.9360374},
researchr = {https://researchr.org/publication/ShinE21},
cites = {0},
citedby = {0},
pages = {147-150},
booktitle = {IEEE Radio and Wireless Symposium, RWS 2021, San Diego, CA, USA, January 17-22, 2021},
publisher = {IEEE},
isbn = {978-1-7281-8062-5},
}