A Thermal-aware Optimization Framework for ReRAM-based Deep Neural Network Acceleration

Hyein Shin, Myeonggu Kang, Lee-Sup Kim. A Thermal-aware Optimization Framework for ReRAM-based Deep Neural Network Acceleration. In IEEE/ACM International Conference On Computer Aided Design, ICCAD 2020, San Diego, CA, USA, November 2-5, 2020. pages 1-9, IEEE, 2020. [doi]

@inproceedings{ShinKK20-2,
  title = {A Thermal-aware Optimization Framework for ReRAM-based Deep Neural Network Acceleration},
  author = {Hyein Shin and Myeonggu Kang and Lee-Sup Kim},
  year = {2020},
  url = {https://ieeexplore.ieee.org/document/9256465},
  researchr = {https://researchr.org/publication/ShinKK20-2},
  cites = {0},
  citedby = {0},
  pages = {1-9},
  booktitle = {IEEE/ACM International Conference On Computer Aided Design, ICCAD 2020, San Diego, CA, USA, November 2-5, 2020},
  publisher = {IEEE},
}