Dense Footprint Cache: Capacity-Efficient Die-Stacked DRAM Last Level Cache

Seunghee Shin, Sihong Kim, Yan Solihin. Dense Footprint Cache: Capacity-Efficient Die-Stacked DRAM Last Level Cache. In Bruce Jacob, editor, Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016. pages 191-203, ACM, 2016. [doi]

@inproceedings{ShinKS16-0,
  title = {Dense Footprint Cache: Capacity-Efficient Die-Stacked DRAM Last Level Cache},
  author = {Seunghee Shin and Sihong Kim and Yan Solihin},
  year = {2016},
  doi = {10.1145/2989081.2989096},
  url = {http://doi.acm.org/10.1145/2989081.2989096},
  researchr = {https://researchr.org/publication/ShinKS16-0},
  cites = {0},
  citedby = {0},
  pages = {191-203},
  booktitle = {Proceedings of the Second International Symposium on Memory Systems, MEMSYS 2016, Alexandria, VA, USA, October 3-6, 2016},
  editor = {Bruce Jacob},
  publisher = {ACM},
  isbn = {978-1-4503-4305-3},
}