Gholamreza Shomalnasab, Howard M. Heys, Lihong Zhang. Analytic modeling of interconnect capacitance in submicron and nanometer technologies. In 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013. pages 2553-2556, IEEE, 2013. [doi]
@inproceedings{ShomalnasabHZ13,
title = {Analytic modeling of interconnect capacitance in submicron and nanometer technologies},
author = {Gholamreza Shomalnasab and Howard M. Heys and Lihong Zhang},
year = {2013},
doi = {10.1109/ISCAS.2013.6572399},
url = {http://dx.doi.org/10.1109/ISCAS.2013.6572399},
researchr = {https://researchr.org/publication/ShomalnasabHZ13},
cites = {0},
citedby = {0},
pages = {2553-2556},
booktitle = {2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013},
publisher = {IEEE},
isbn = {978-1-4673-5760-9},
}