Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes

Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu. Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. Microelectronics Reliability, 52(11):2690-2700, 2012. [doi]

Abstract

Abstract is missing.