An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Prachi Shukla, Ayse Kivilcim Coskun, Vasilis F. Pavlidis, Emre Salman. An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. In Houman Homayoun, Baris Taskin, Tinoosh Mohsenin, Weisheng Zhao, editors, Proceedings of the 2019 on Great Lakes Symposium on VLSI, GLSVLSI 2019, Tysons Corner, VA, USA, May 9-11, 2019. pages 439-444, ACM, 2019. [doi]

This author has not been identified. Look up 'Prachi Shukla' in GoogleThis author has not been identified. Look up 'Ayse Kivilcim Coskun' in GoogleThis author has not been identified. Look up 'Vasilis F. Pavlidis' in GoogleThis author has not been identified. Look up 'Emre Salman' in Google

runs on WebDSL