Prachi Shukla, Ayse Kivilcim Coskun, Vasilis F. Pavlidis, Emre Salman. An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. In Houman Homayoun, Baris Taskin, Tinoosh Mohsenin, Weisheng Zhao, editors, Proceedings of the 2019 on Great Lakes Symposium on VLSI, GLSVLSI 2019, Tysons Corner, VA, USA, May 9-11, 2019. pages 439-444, ACM, 2019. [doi]
Abstract is missing.